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Model FB2425E50100A00
Rev A
Ultra Low Profile Filter Balun 50 to 100 Balanced
Description
The FB2425E50100A00 is a low cost, low profile sub-miniature unbalanced to balanced transformer designed for differential inputs and output locations on next generation wireless chipsets in an easy to use surface mount package covering wireless LAN (802.11b/g/n) and Bluetooth frequencies (2400 MHz - 2500 MHz). The FB2425E50100A00 is ideal for high volume manufacturing and is in a lower profile unit than traditional ceramic parts. The FB2425E50100A00 has an unbalanced port impedance of 50 and a 100 balanced port impedance. This transformation enables single ended signals to be applied to differential ports on modern semiconductors. The output ports have equal amplitude (-3dB) with 180 degree phase differential. The FB2425E50100A00 is available on tape and reel for high volume pick and place manufacturing.
Detailed Electrical Specifications: Specifications subject to change without notice.
ROOM (25C)
Features:
* * * * * * * * * * * * * * 2.4 - 2.5 GHz. Low Height Profile 50 Ohm to 2 x 50 Ohm 802.11b + g + n Compliant Medium Power No DC Decoupling Capacitors Required Input to Output DC Isolation Surface Mountable Tape & Reel Integral Filter Integrated Bandpass Filter Inverted Balun Configuration Non-conductive Surface RoHS Compliant
Parameter Frequency Unbalanced Port Impedance Balanced Port Impedance Return Loss Insertion Loss* Amplitude Balance Phase Balance Attenuation @ 930 MHz. Attenuation @ 1500 MHz. Attenuation @ 1910 MHz. Attenuation @ 4800 MHz. Attenuation @ 5000 MHz. Power Handling Thermal Resistance Operating Temperature
Min. 2.4
Typ. 50 100 14 2.3 0.5 63 52 52 22 25 27
Max 2.5
9.5
2.6 1.0 65
45 45 18 23 25
-55
0.5 TBD +85
Unit GHz dB dB dB Degrees dB dB dB dB dB Watts C / Watt C
* Insertion Loss stated at room temperature (2.8 dB Max at +85 C)
Pin Configuration
The internal configuration of the Ultra low profile filter balun is diagramed to the left. A lumped element filter is located in front of the unbalanced input of the balun. The unbalanced port is terminated in an open-circuit and the two balanced ports are connected to ground. The use of differential circuits is increasing in highly integrated circuits, because of its inherent noise immunity properties. Differential circuits have superior performance when looking at properties like cross coupling, immunity to external noise sources and power supply noise. When designing power amplifiers differential circuits also help minimize nd rd 2 and 3 order intermodulation products. The construction of the filter balun is bonded multi-layered stripline made of low loss dielectric material with plated through vias connecting the internal circuitry to the external printed circuit board, similar to that of the other hybrids and directional couplers
1 Port1 2
1 2
Port2
Port3
Available on Tape and Reel for Pick and Place Manufacturing.
USA/Canada: Toll Free: Europe:
(315) 432-8909 (800) 411-6596 +44 2392-232392
Model FB2425E50100A00
Rev A
Outline Drawing
Top View (Near-side) Side View Bottom View (Far-side) 2X .008 [0.20] 3 GND 2X .016 [0.40] 2 1
.106.005 [2.700.13]
.029.003 [0.740.08]
.011 [0.28] GND .018 [0.45]
.007 [0.18]
.079.005 [2.000.13] .011 [0.28]
Pin 1 2 3 4 5 6 Designation GND/NC Unbalanced Port GND/NC Balanced Port 1 GND/NC Balanced Port 2
Orientation Marker Denotes Pin Location
Orientation Marker Denotes Pin Location
4 5
9X .008 [0.20] 6 10X .012 [0.30]
Dimensions are in Inches [Millimeters] Mechanical Outline
Typical Broadband Performance: 0 GHz. to 6 GHz.
USA/Canada: Toll Free: Europe:
(315) 432-8909 (800) 411-6596 +44 2392-232392
Available on Tape and Reel for Pick and Place Manufacturing.
Model FB2425E50100A00
Rev A
Typical Pass Band Performance: 2.4 GHz. to 2.5 GHz.
Mounting Configuration:
.107 [2.71] 3X .012 [0.30] 4X .016 [0.40]
.007 [0.18] .017 [0.43]
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet published specifications. All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/oC.
An example of the PCB footprint used in the testing of these parts is shown to the left. In specific designs, the transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.
.041 [1.05]
2X .011 [0.28] Plated thru hole to ground 3X 50 Transmission Line Circuit Pattern Footprint Pad (s) Solder Resist Dimensions are in Inches [Millimeters] Mounting Footprint
3X .010 [0.25]
3X .012 [0.30]
Available on Tape and Reel for Pick and Place Manufacturing.
USA/Canada: Toll Free: Europe:
(315) 432-8909 (800) 411-6596 +44 2392-232392
Model FB2425E50100A00
Rev A
Packaging and Ordering Information
Parts are available in reel and are packaged per EIA 481-2. Parts are oriented in tape and reel as shown below. Minimum order quantities are 4000 per reel. See Model Numbers below for further ordering information.
OA
OC
OD
QUANTITY/REEL 4000
TABLE 1 REEL DIMENSIONS (inches [mm]) OA 7.00 [177.8] B 0.32 [8.0] OC 2.0 [50.8] OD 0.512 [13.0]
B
USA/Canada: Toll Free: Europe:
(315) 432-8909 (800) 411-6596 +44 2392-232392
Available on Tape and Reel for Pick and Place Manufacturing.
Model FB2425E50100A00
Rev A
Available on Tape and Reel for Pick and Place Manufacturing.
USA/Canada: Toll Free: Europe:
(315) 432-8909 (800) 411-6596 +44 2392-232392

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